Summit

High Performance Thermal Control Pick and Place Handler

The Summit handler is designed for high power applications that require heat dissipation under test. A proprietary thermal management and control system maximizes thermal response while minimizing Tj rise. With its chamberless, conductive, thermal design, the Summit handler is is the industry standard for testing microprocessors, high-speed graphics ICs, and other high-speed, high-power devices.

Scalable Platform

• Test Site Parallelism: x1 or x2
• Active Thermal Control (ATC) range -10°C to +125°C ; -45°C to +150°C (optional)
• Passive Thermal Control (PTC) range -10°C to +110°C; -55°C to +125°C (optional)
• Hybrid Solution (PTC-HP)
• Vision Alignment (patented)
• Package Interface: Liquid dispensing available (patented)
• 5 automated bins (13" stack) standard; 7 optional

High Productivity

• BGA, LGA, PGA, MCM, etc.
• Lidded or Bare Die Packages
• Package size: 10 mm sq up to 55 mm sq (larger packages optional)
• 2D Vision Code reader
• PGA lead inspection
• Foreign material device inspection
• Auto Contactor Cleaning
• Golden Unit testing

Advanced Thermal Technology

• Conductive thermal conditioning and control
• Power Balancing™ for precise junction temperature control (patented)
• Control Modes: HTF - Heater Temperature Feedback, DTF - Device Temperature Feedback, PF - Power Following (patented)
• Up to 500W active power dissipation during test (device, die size, power density, and interface dependent)
• Accommodates power densities up to 100 Watts/cm2
• Characterized temperature control through power sensing
• Internal device diode temperature monitoring (optional)